Parker Chomerics THERM-A-FORM™ CIP35 is two component dispensable thermal compound with 3.5 W/m-K thermal conductivity.

Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.

Parker Chomerics THERM-A-FORM™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W/m-k thermal conductivity.

Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity

Parker Chomerics THERM-A-FORM™ T647 is a two-component. Low modulus, high thermal conductivity (3.0 W/m-k) silicone elastomer ideal for filling complex geometries and maintaining contact with electrical components.

Parker Chomerics THERM-A-FORM™ T646 is a two-component, high pot life (5 hours), economical silicone elastomer with 0.9 W/m-k thermal conductivity

Parker Chomerics CHO-BOND® 1087 primer is a low viscosity, blue liquid formulated to provide adhesion between our CHO-THERM® 1642 two component silicone based compound and non-silicone substrates such as metals, glass, plastic and ceramics.

CoolTherm® EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.

CoolTherm® EP-301 AD resin is a general purpose epoxy resin designed for use with CoolTherm EP-6010 hardener to create a two-component system for applications requiring excellent heat transfer, high fluidity and good air release.

CoolTherm® EP-340/18 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-340/67 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-340/70 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-3500 epoxy system is a two-component system for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

CoolTherm® EP-3500/EP-2000 two-component epoxy system is for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

CoolTherm® EP-6008 BLK/6010 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

CoolTherm® EP-6008 BLK/6252 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

CoolTherm® EP-6008 BLK/Thermoset No.67 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

Parker Chomerics THERM-A-GAP™ GEL 20 is a dispensable gel that has 2.4 W/m-K Thermal Conductivity as a one component fully cured system.

Parker Chomerics THERM-A-GAP™ GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ Gel 30 is a single-component, fully cured, dispensable gel with 3.5 W/m-K Thermal Conductivity

Parker Chomerics THERM-A-GAP™ GEL 30G is a 3.5 W-m/K, fully cured dispensable thermal interface gel with added glass beads for bondline thickness control.

Parker Chomerics THERM-A-GAP™ GEL 37 is a single-component, fully cured, dispensable thermal gel with 3.7 W/m-K Thermal Conductivity, designed for more consistent and repeatable dispensing by minimizing batch-to-batch flow rate variations.

Parker Chomerics THERM-A-GAP™ GEL 40NS is a single-component, non-silicone, fully cured, dispensable gel with 4.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ Gel 45 is a single-component, fully cured, dispensable gel with 4.5 W/m-K Thermal Conductivity

Parker Chomerics THERM-A-GAP™ GEL 60HF is a single-component, fully cured, dispensable gel with 6.2 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.

Parker Chomerics THERM-A-GAP™ Gel 8010 is a single-component, fully cured, thin bond line, dispensable gel with 3.0 W/m-K Thermal Conductivity

Parker Chomerics THERM-A-GAP™ Gel T630 is a highly conformable, pre-cured, single-component compound with 0.7 W/m-K Thermal Conductivity.

Parker Chomerics THERM-A-GAP™ Gel T635 is a highly conformable, pre-cured, single-component compound with 1.7 W/m-K Thermal Conductivity.

Parker Chomerics THERM-A-GAP™ Gel T636 is a highly conformable, pre-cured, single-component compound with 2.4 W/m-K Thermal Conductivity.

Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity

CoolTherm® MG-120 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel.

CoolTherm® MG-121 thermally conductive gel is a one-component, silicone interface material that exhibits very low thermal resistance properties compared to other thermal interface materials. It is formulated to provide good HAST resistance.

CoolTherm® MG-122 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel. It is specifically developed for excellent HAST resistance.

CoolTherm® MG-133 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel.

Parker Chomerics T650 Thermal Grease is a general purpose grease ideal for applications on heat sinks with a thermal conductivity of 0.8 W/m-k.

Parker Chomerics T660 Thermal Grease is a low viscosity grease with 0.9 W/m-k thermal conductivity and serves as an ideal solution for think bond line applications.

Parker Chomerics T670 Thermal Grease is a high performance (3.0 W/m-k thermal conductivity) grease ideal for thin bond line applications.

Parker Chomerics T-Wing Thin Heat Spreaders provide a low cost, effective means of cooling high-density integrated circuit devices by conducting heat away from key components.

Parker Chomerics THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads provide a soft (34 Shore 00) solution with 3.2 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ PAD 60 Thermally Conductive Gap Filler Pads provide a low hardness (40 Shore 00) solution with 6.0 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads provide a very low hardness (15 Shore 00) solution with 7.0 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ PAD 80 Thermally Conductive Gap Filler Pads provide a low hardness (35 Shore 00) solution with 8.3 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ 569 Thermally Conductive Gap Filler Pads provide a very low hardness (10 Shore 00) solution with 1.5 W/m-K thermal conductivity

Parker Chomerics THERM-A-GAP™ 570 Thermally Conductive Gap Filler Pads provide a low hardness (25 Shore 00) solution with 1.5 W/m-K of thermal conductivity

Parker Chomerics THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads provide a low hardness (30 Shore 00) solution with 3.0 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ 580 Thermally Conductive Gap Filler Pads provide a moderate hardness (75 Shore 00) solution with 3.0 W/m-K of thermal conductivity

Parker Chomerics THERM-A-GAP™ 974 Thermally Conductive Gap Filler Pads provide a low hardness (40 Shore A) solution with 6.0 W/m-K of thermal conductivity

Parker Chomerics THERM-A-GAP™ 976 Thermally Conductive Gap Filler Pads provide a low hardness (10 Shore A) solution with 6.5 W/m-K of thermal conductivity

Parker Chomerics THERM-A-GAP™ G974 Thermally Conductive Gap Filler Pads provide a low hardness (40 Shore A) solution with 5.0 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ HCS10 Thermally Conductive Gap Filler Pads provide an ultra low hardness (4 Shore 00) solution with 1.0 W/m-K of thermal conductivity

Parker Chomerics CHO-THERM Thermally Conductive Electrical Insulator Pads are designed for use where the highest possible thermal, dielectric, and mechanical properties are required.

Parker Chomerics THERMFLOW phase-change thermal Interface Materials (TIMs) are solid at room temperature and become liquid at the phase-change temperature, completely filling interfacial air gaps and voids.

CoolTherm® EP-6006 HS/6011 epoxy system is a two-component, pourable, ceramic-filled epoxy for bonding current-carrying conductors. Specifically formulated to meet UL 94 V-0 non-burning requirements.

CoolTherm® EP-6007 BLK/6010 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.

CoolTherm® EP-6007 BLK/Thermoset No. 67 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.

CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.

CoolTherm® EP-6037/6252 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.

CoolTherm® EP-6150 adhesive is a one-component, thixotropic epoxy adhesive for use in the assembly of electronic components and devices. Offers good adhesion to wide variety of substrates; can be used in demanding high-end device assembly applications.

CoolTherm® EP-6151 adhesive is a one-component, aluminum-filled epoxy adhesive designed for use as a thermal interface adhesive for heat sink attachment and other applications requiring good adhesion and heat transfer properties.

CoolTherm® EP-6960 silver-filled conductive adhesive offers excellent electrical conductivity and room temperature stability. It is designed for use with automated dispensing, stamping and screen-printing application equipment.

CoolTherm® EP-6972 adhesive is a two-component, silver-filled, epoxy conductive adhesive which offers good electrical and thermal conductivity. This adhesive system requires an elevated temperature cure, and is designed for general circuit board repair.

CoolTherm® EP-96 adhesive is a one-component, thixotropic epoxy adhesive for use in the assembly of electronic components and devices. This adhesive is a modified version of CoolTherm EP-6150 adhesive with enhanced air-release characteristics.

CoolTherm® MD-161 conductive adhesive offers excellent electrical conductivity. It is designed for dispensing through small nozzles and ideally suited for demanding LED assembly applications.

CoolTherm® MT-125 thermally conductive adhesive is a rapid cure, one-component adhesive specifically designed for applications requiring a long working life adhesive with high thermal conductivity.

CoolTherm® MT-220C thermally conductive adhesive is a fast cure, one-component, silicone hybrid adhesive used for bonding silicone to silicone and metal to metal, as well as ceramic, plastic or metal lids to a heat sink.

CoolTherm® MT-322 thermally conductive adhesive is a one-component silicone adhesive for use in assemblies where thermal dissipation is desired. Adhesive cures to form flexible elastomer offering superior high temperature electrical properties.

CoolTherm® SC-322 thermally conductive adhesive is a one-component silicone adhesive for use where thermal dissipation is desired. Contains 125-175 micron glass beads; cures to flexible elastomer that offers superior high temp electrical properties.

CoolTherm® TC-2002 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® SC-3500 thermally conductive, low volatile silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® SC-6754 grease is a one-component silicone material used to provide a thermal path between semiconductors and heat sinks by displacing the air gap between the mating surfaces. It is also used as a non-curing, shock resistant sealant.

CoolTherm® TC-404 thermally conductive grease is a non-reactive, solvent-free silicone material designed for applications where a highly conductive thermal interface material is required and where the device may later need to be easily removed.

CoolTherm® TC-501 grease is a solvent-free silicone thermal interface material designed to replace greases used as TIMs between the heat spreader and the heat sink (commonly known as TIM2).

CoolTherm® UR-2000 gap filler is a two-component thermally conductive urethane system designed to provide thermal conductivity for electronic applications. It cures at room temperature to produce a flame retardant adhesive.

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